Vertaling en analyse van woorden door kunstmatige intelligentie ChatGPT
Op deze pagina kunt u een gedetailleerde analyse krijgen van een woord of zin, geproduceerd met behulp van de beste kunstmatige intelligentietechnologie tot nu toe:
- hoe het woord wordt gebruikt
- gebruiksfrequentie
- het wordt vaker gebruikt in mondelinge of schriftelijke toespraken
- opties voor woordvertaling
- Gebruiksvoorbeelden (meerdere zinnen met vertaling)
- etymologie
Wat (wie) is surface mount - definitie
![Surface-mount [[capacitor]]](https://commons.wikimedia.org/wiki/Special:FilePath/Big SMD capacitor 2.jpg?width=200 "Surface-mount [[capacitor]]")
![Assembly line with [[pick-and-place machine]]s](https://commons.wikimedia.org/wiki/Special:FilePath/Juki KE-2080L by Megger.jpg?width=200 "Assembly line with [[pick-and-place machine]]s")
![A [[MOSFET]] [[transistor]], placed upon a British postage stamp for size comparison.](https://commons.wikimedia.org/wiki/Special:FilePath/SMDcompared.jpeg?width=200 "A [[MOSFET]] [[transistor]], placed upon a British postage stamp for size comparison.")
![two-terminal packages]] and comparison included](https://commons.wikimedia.org/wiki/Special:FilePath/SMT sizes, based on original by Zureks.svg?width=200 "two-terminal packages]] and comparison included")
![soldering tweezers]]](https://commons.wikimedia.org/wiki/Special:FilePath/Soldering a 0805.jpg?width=200 "soldering tweezers]]")
.png?width=200 "1= ''z'' = (''R'' + ''r'' cos ''v'') cos ''u''}}.")
![Parametric surface forming a [[trefoil knot]], equation details in the attached source code.](https://commons.wikimedia.org/wiki/Special:FilePath/Parametric surface illustration (trefoil knot).png?width=200 "Parametric surface forming a [[trefoil knot]], equation details in the attached source code.")
![surface]] of the [[Moon]], which consists of [[lunar regolith]] (photographed by [[Neil Armstrong]], July 1969).](https://commons.wikimedia.org/wiki/Special:FilePath/Aldrin Apollo 11 original.jpg?width=200 "surface]] of the [[Moon]], which consists of [[lunar regolith]] (photographed by [[Neil Armstrong]], July 1969).")
![Perseverance]] rover.](https://commons.wikimedia.org/wiki/Special:FilePath/HSF 0163 0681410921 308ECM N0110001HELI00000 000085J Perseverance Spotted By Ingenuity's colour camera On Its 11th Flight.gif?width=200 "Perseverance]] rover.")
![Perspective radar view of Titan's [[Bolsena Lacus]] (lower right) and other northern hemisphere hydrocarbon lakes](https://commons.wikimedia.org/wiki/Special:FilePath/Liquid lakes on titan.jpg?width=200 "Perspective radar view of Titan's [[Bolsena Lacus]] (lower right) and other northern hemisphere hydrocarbon lakes")
![Full-sized image]])''](https://commons.wikimedia.org/wiki/Special:FilePath/OSIRIS-REX SamCam TAGSAM Event 2020-10-20 small.gif?width=200 "Full-sized image]])''")
![Sand dunes in the [[Namib Desert]] on Earth (top), compared with dunes in Belet on Titan](https://commons.wikimedia.org/wiki/Special:FilePath/Titan dunes crop.png?width=200 "Sand dunes in the [[Namib Desert]] on Earth (top), compared with dunes in Belet on Titan")
Wikipedia
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
